Tantalum barrier layer for copper metallization

ABSTRACT

A method of forming barrier layers in a via hole extending through an inter-level dielectric layer and including a preformed first barrier coated onto the bottom and sidewalls of the via holes. In a single plasma sputter reactor, a first step sputters the wafer rather than the target with high energy ions to remove the barrier layer from the bottom of the via but not from the sidewalls and a second step sputter deposits a second barrier layer, for example of Ta/TaN, onto the via bottom and sidewalls. The two steps may be differentiated by power applied to the target, by chamber pressure, or by wafer bias. The second step may include the simultaneous removal of the first barrier layer from the via bottom and sputter deposition of the second barrier layer onto the via sidewalls.

RELATED APPLICATION

This application is a division of Ser. No. 10/290,746, filed Nov. 7,2002, issue fee paid, which is a continuation of Ser. No. 09/704,161,filed Nov. 1, 2000, now issued as U.S. Pat. No. 6,498,091.

FIELD OF THE INVENTION

The invention relates generally to processes for formation of verticalinterconnects in integrated circuits. In particular, the inventionrelates to a tantalum barrier layer for copper metallization.

BACKGROUND ART

Modern integrated circuits include several levels of metallizationformed over the active semiconductor circuitry formed in the substrate,most commonly a silicon wafer. The multiple metallization layers arerequired to interconnect the millions to tens of millions of discretesemiconductor devices formed in a single integrated circuit. Foradvanced microprocessors, there may be five or more levels ofmetallization.

Each metallization layer includes a dielectric layer, for example, ofsilicon dioxide or possibly a low-k dielectric material deposited overthe previous layer, a via (or contact) hole etched through thedielectric layer, and a metallization including a vertical metallic plugfilled into the hole and a horizontal interconnect formed on top of thedielectric layer.

The formation of vias has become increasingly crucial with thecontinuing shrinkage of critical dimensions and the transition to copperrather than aluminum interconnects. Contacts to underlying silicon willfor the most part not be explicitly described hereafter but can equallybenefit from the various aspects of the invention.

A generic via is illustrated in the cross-sectional view of FIG. 1. Itincludes a lower dielectric layer 12 (which in the case of a contact isa silicon-containing layer) having formed therein a conductive feature14, such as another metallization or, in the case of a contact, acontact region of a transistor. An upper level dielectric layer 16overlies the lower dielectric layer 12 and the conductive feature 14.Advanced plasma etching processes etch a via hole 18 through the upperdielectric layer 16 to the vicinity of the conductive feature 14. Thisexplanation avoids many details about etch stop layers, horizontalinterconnects, and advanced structures, particularly including dualdamascene, but the fundamental concepts for the invention remain thesame.

Prior to filling metallization into the via hole 18, the hole is linedwith a barrier layer 20 to prevent the diffusion of aluminum or copperinto the dielectric 16, which would short out the dielectric betweenneighboring via, or the diffusion of oxygen from the dielectric 16 intothe metallization, which reduces the conductivity of the plug. Onlythereafter is a metallization plug 22 filled into the via hole 18. Inthe case of copper metallization, the filling process typically includesa physical vapor deposition or sputtering (PVD) deposition of a copperseed layer followed by an electrochemical plating (ECP) of copper intothe hole.

The barrier structure has become increasingly important as the lateralcritical dimension has shrunk to 0.25 μm and below while the verticaldimension has remained virtually static at between 0.7 and 1.51 μm. As aresult, the aspect ratio of the via hole 18 has increased, and theelectrical resistance of the vertical electrical metallization hasbecome increasingly important. This emphasis on reduced verticalimpedance has been further heightened by the substitution of copper foraluminum as the most desired metallization since copper has a lower bulkresistivity. However, the controlling parameter is the total resistancealong a path, including the resistance through the bottom barrier layerportion 24 at the bottom of the via 18. Particularly in the case of aninter-metal dielectric between two metallizations of the same metal,there is no need to include the bottom barrier layer portion 24 sincethe copper or other metal in the via 22 will be contacting a same metalin the conductive feature 14.

In U.S. Pat. No. 5,985,762, Geffken et al. have disclosed directionallyetching away the barrier layer exposed on horizontal surfaces of acopper dual-damascene structure but leaving the barrier layer on thesidewalls to protect the dielectric sidewalls from copper sputtered fromthe underlying copper feature. This process requires presumably aseparate etching chamber. Furthermore, the process deleteriously alsoremoves the barrier at the bottom of the trench in a dual-damascenestructure. They accordingly deposit another conformal barrier layer,which remains under the metallized via.

In commonly assigned U.S. patent application Ser. No. 09/518,180 filedMar. 2, 2000, now issued as U.S. Pat. No. 6,277,249, Gopalraja et al.have suggested that a self-ionized plasma sputter deposition of a copperseed layer for a copper metallization 22 can be used to remove thebottom barrier layer portion 24.

Accordingly, it is desired to provide a structure and method of makingit which reduces the contact resistance at the bottom of a via.

It is further desired to provide such structure and method withoutunduly complicating the integrated circuit fabrication process.

SUMMARY OF THE INVENTION

One aspect of the invention includes removing a barrier layer formed atthe bottom of a via by a sputter etching process performed in a plasmasputter deposition chamber. The same sputter deposition chamber mayadvantageously be used to then deposit a second barrier layer.

The invention also includes the aspect of removing the barrier layer atthe bottom of the via and simultaneously depositing a second barrierlayer on vertically extending sidewalls.

Another aspect of the invention includes removing the barrier layer atthe bottom of the via while not removing the barrier layer from someother horizontally extending surfaces. The selective removal can beeffected by simultaneously sputter depositing a second barrier layer onthese other horizontal surfaces. The selective deposition of the secondbarrier layer can be advantageously followed by the sputter depositionin the same sputter reactor of another layer of the second barrier layerunder different conditions such that the additional layer is alsodeposited on the via bottom.

The combined process may be performed in an inductively coupled plasmasputter reactor in which, during the removal step, the sputtering targetis not energized and thus not sputtered, but, during the deposition ofthe second barrier layer, it is energized to be sputtered. During theremoval step, the inductive coil generates a plasma of the sputteringworking gas, and the wafer is biased to attract the working gas ions.

The invention includes structures achievable by the invention in which abarrier layer is coated on the sides of the hole but not its bottom. Italso includes a dual-damascene structure in which the barrier is coatedon the trench floor but not on the via bottom.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a generic via structure of the priorart.

FIG. 2 is a cross-sectional view of a via structure coated with a CVDbarrier layer.

FIG. 3 is a cross-sectional view of the via structure of FIG. 2 with thebottom portion of the CVD barrier layer being removed in a PVD chamber.

FIG. 4 is a cross-sectional view of the via structure of FIG. 3 furthercoated with a PVD barrier layer.

FIG. 5 is a cross-sectional view of the via structure of FIG. 4 coatedwith a copper seed layer and then electro-chemically filled with copper.

FIG. 6 is a cross-sectional view of the vis structure of FIG. 5 aftercompletion of the inter-level dielectric level by chemical mechanicalpolishing.

FIG. 7 is a cross-sectional view of a via structure with the CVD barrierbeing removed from the bottom of the via at the same time that a firstPVD barrier layer is deposited at least on the via sidewalls andpossibly in the field area over the top of the dielectric.

FIG. 8 is a cross-sectional view of the via structure of FIG. 7 with thefurther deposition of a second PVD barrier layer.

FIG. 9 is a cross-sectional view of the via structure of FIG. 8 aftercompletion of copper metallization.

FIG. 10 is a cross-sectional view of a dual-damascene structure afterdeposition of the barrier and seed layers.

FIG. 11 is a cross-sectional view of the structure of FIG. 10 afterelectroplating and chemical mechanical polishing.

FIG. 12 is a flow diagram of an integrated process liner depositionprocess.

FIG. 13 is schematic plan view of an integrated tool capable ofperforming the integrated process of FIG. 12.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

It is has been found useful to form a via barrier in two chambers. Thefirst step is performed in a CVD (chemical vapor deposition) chamber inwhich a CVD barrier layer 30, as illustrated in the cross-sectional viewof FIG. 2, is first deposited having a composition of titanium siliconnitride (TiSiN). Again, the illustrated structure ignores features suchas etch stop layers and dual-damascene holes. The CVD barrier layer 30may be formed by a three-step process in the T×Z plasma CVD reactor,available from Applied Materials, Inc. of Santa Clara, Calif. Zhao etal. describe a version of this chamber and a TiN deposition procedure inU.S. Pat. No. 5,846,332. In the first step, a TiN layer is deposited toa thickness of about 5 nm by a well known process of thermal chemicalvapor deposition at about 350° C. using tetrakis-dimethyl-amido titanium(TDMAT) as the precursor gas. Koai et al. describe an alternative plasmaCVD process and chamber in U.S. Pat. No. 6,106,625. The thermal CVD isfollowed by a plasma treatment in the same chamber of the wafer held at350° C. The same chamber is used for the third step of a thermal soak ofthe wafer in the presence of silane (SiH₄) to convert the TiN to TiSiN.The CVD process is nearly conformal and coats the sidewalls and bottomof the via hole including a CVD barrier bottom portion 32, a CVD barriersidewall portion 34, and a CVD barrier field portion 36 on top of thedielectric layer 16.

Following the formation of the CVD barrier layer 30, the substrate istransferred to a physical vapor deposition (PVD) chamber in which atantalum target is used as the sputtering target. The PVD chamber shouldbe one which is capable of producing a relatively high ionizationfraction of sputtered atoms, for example, above 10%. The chamberpreferably also has the capability of biasing the pedestal electrodesupporting the electrode. Typically, the biasing involves applying an RFbias signal, for example, at 13.56 MHz to the pedestal electrode. The RFpower creates a negative DC bias on the pedestal and thus acceleratespositively charged sputtered metal ions to the wafer.

One reactor satisfying these requirements is the Endura IMP (ion metalplating) sputter reactor available from Applied Materials. This reactoruses an inductive coil to couple RF power into a remote plasma sourceregion. This reactor operates at relatively high argon pressures ofabout 20 milliTorr to produce a large volume of a high-density plasma,that is, one having an ionization fraction of at least 10¹¹ cm⁻³. Metalionization fractions may exceed 50% or even 75% in an IMP reactor.

Two other reactors being developed by Applied Materials can also be usedfor the process of the invention. Both are more conventional DC diodemagnetron reactors not relying on RF inductive coupling to create theplasma. Various techniques are used to create a relatively high densityplasma in a small portion of the target. The magnetron is scanned overthe back of target to provide the required uniformity. Both thesereactors can be operated at relatively low pressures of about 1milliTorr or somewhat less. Their metal ionization fractions aresomewhat lower, in the 10% to 50% range. Fu describes an SIP(self-ionized plasma) reactor in U.S. patent application Ser. No.09/373,097, filed Aug. 12, 1999, now issued as U.S. Pat. No. 6,183,614.This reactor uses a flat target and a small unbalanced magnetron havinga strong magnetic pole of one polarity surrounding a weaker magneticpole of the other polarity. Praburam et al. describe an SIP⁺ reactor inU.S. patent application Ser. No. 09/518,180, filed Mar. 2, 2000, nowissued as U.S. Pat. No. 6,277,249. This reactor includes a target havinga large annular groove or vault formed in its side facing the wafer.Various magnets are placed adjacent to the sidewalls and roof of thevault. Very high plasma densities are formed within portions of thevault, thereby increasing the metal ionization fraction.

According to the invention, the same PVD chamber performs two steps. Thefirst step has the effect of removing the CVD barrier layer at thebottom of the via hole, and the second step completes the deposition ofthe PVD barrier layer. Two embodiments of the two-step process will bedescribed. In the first embodiment, the first step deposits no materialand only sputters the CVD barrier layer. In the second embodiment, thefirst step combines removal at the bottom of the via hole and depositionof some PVD barrier material in areas other than the bottom of the viahole.

In the first embodiment, particularly as practiced in an IMP chamberconfigured for sputter deposition of a barrier layer, an argon plasma isformed and the pedestal electrode is RF biased to create a significantnegative DC self-bias to strongly attract the argon ions to thepedestal. The IMP chamber allows the formation of an argon plasmawithout sputtering the tantalum target by exciting the plasma throughthe inductive coil and not significantly DC biasing the target. Thehighly directional high-energy argon ions incident on the wafer removeor sputter the CVD barrier bottom and field portions 32, 36. That is, asputtering process is performed on the wafer, not a sputter depositionprocess. However, the argon ions do not remove the CVD barrier sidewallportion 34, as illustrated in the cross-sectional view of FIG. 3,because the ions are mostly traveling parallel to the sidewall. In fact,some of the barrier material sputtered from the CVD barrier bottomportion 32 will deposit on the sidewall. Further, the argon ions mayeven slightly etch into the exposed face 38 of the underlying metallicfeature 14. The etching of the metallic feature 14 may be advantageousas a pre-cleaning step to remove any oxide that has spontaneously formedthere. The removal of the CVD barrier bottom portion 32 at the bottom ofthe via hole 18 is advantageous because the TiSiN CVD bottom barrierwould increase the contact resistance between the plug to be formed inthe via hole 18 and the conductive feature. Gopalraja et al. havedescribed in the above cited patent application a similar sputterremoval of a barrier layer during sputter deposition of a copper seedlayer.

Thereafter, in a second step performed in the same barrier PVD reactor,a PVD barrier layer 40 is sputter deposited, with the chamber conditionsadjusted to produce a sufficiently high energy in the sputtered metalions that they coat not only the top of the dielectric layer 16 but alsoover the CVD barrier layer 30 on the sidewalls of the via hole 18(although the sidewall coverage is small), and at the bottom of the viahole 18 in direct contact to the metallic feature 14. The second steppreferably at least begins with the sputter deposition of tantalum orother barrier metal. The second step may include a subsequent depositionof tantalum nitride by admitting nitrogen into the plasma reactor toeffect reactive sputtering.

Exemplary process conditions for the two steps are presented in TABLE 1for the IMP reactor. TABLE 1 Step 1 Step 2 Target Power 0 1 (kW) CoilPower 1 2.5 (kW) Pressure 1 38 (milliTorr) Wafer Bias Power 600 350 (W)Bias Duty Cycle 100 50 (%)These parameters show that the IMP chamber is being operated in thewafer pre-clean mode in the first step and in an ionized sputterdeposition mode in the second step.

The wafer is then moved to a copper PVD chamber for deposition of a thincopper seed layer 44, illustrated in the cross-sectional view of FIG. 5.The copper seed layer 44 is needed to act as an electrode for thesubsequent electro-chemical plating (ECP) of copper and to nucleate theECP copper. The copper seed layer 44 is preferably performed in eitheran IMP reactor, a SIP reactor, or a SIP⁺ reactor although other sputterreactors may be satisfactory. Thereafter, the via hole is filled andoverfilled with a copper layer 46 deposited by an ECP process. Theexcess copper as well as most typically the field portions of thevarious barriers are removed by chemical mechanical polishing (CMP),which stops on the hard dielectric 16 to produce the structure of FIG.6. It is assumed that a dual-damascene or similar interconnect structureis used so that the remaining metal 48 acts both as a via to theunderlying metallic feature 14 and as a horizontal interconnect justbelow the surface of the dielectric layer 16.

In the SIP and SIP⁺ sputter reactors as currently configured as well asin other typical diode reactors, the target needs to be powered tocreate a plasma. In the case of a Ta/TaN barrier, tantalum is beingsputtered from the target in the first step. However, it is possible todivide the tantalum sputtering into two steps, the first producingtantalum ions having high energy, the second producing tantalum ionshaving lower energy so that the first step operates in the sputterremoval mode with respect to the wafer while the second step operates inthe sputter deposition mode. But, the geometry of the via hole makes thesituation more complex.

In the first step, chamber conditions are adjusted to produce tantalumions having relatively high energies as they are attracted to the waferto deposit, as illustrated in the cross-sectional view of FIG. 7, afirst PVD barrier layer 70, typically of tantalum for coppermetallization. As a result, the ions that are attracted to the bottom ofthe via 18 have such high energy that, not only do they not deposit onthe bottom, they sputter away the underlying CVD barrier bottom portion32 of FIG. 2 and may even slightly etch into the exposed face 38 of theunderlying metallic feature 14. With the finite tantalum ion flux, asidewall portion 74 of the first PVD barrier layer 70 is formed on thesides of the via hole 18, partially from the metal ions reflected offthe via bottom. The situation in the field area atop the dielectriclayer 16 is more complex. If the tantalum ion fraction is high and theion energy is sufficiently high, then the field portions of the firstPVD barrier layer 70 does not form and instead the field portion 36 ofthe CVD barrier is removed. However, in SIP and SIP⁺ sputtering, it ispossible to balance the ion and neutral fractions. The neutral fractiondoes not reach the protected bottom of the via hole but does reach thefield region with modest energy because they are not affected bypedestal biasing. Therefore, they can deposit on the field region morequickly than the energetic ions are removing material there. Therefore,it is possible to achieve a net deposit of the first PVD barrier layer70 over the field area. Gopalraja et al. have described in the abovecited patent application a similar sputter removal of a barrier layerduring sputter deposition of a copper seed layer.

Thereafter, in a second step of the PVD barrier deposition, a second PVDbarrier layer 80, illustrated in FIG. 8, is deposited in the same PVDchamber with the chamber conditions adjusted to produce a lower energyfor the sputtered metal ions. With the lower energies, the second PVDbarrier layer 80 forms with a bottom portion 82, a sidewall portion 84,and a field portion 86. The second step preferably at least begins withthe sputter deposition of tantalum or other barrier metal. The secondstep may include a subsequent deposition of titanium nitride byadmitting nitrogen into the plasma reactor to effect reactivesputtering.

In the first step, chamber conditions are adjusted to produce tantalumions having relatively high energies as they are attracted to the waferto deposit, as illustrated in the cross-sectional view of FIG. 7, afirst PVD barrier layer 70, typically of tantalum for coppermetallization. As a result, the ions that are attracted to the bottom ofthe via 18 have such high energy that, not only do they not deposit onthe bottom, they sputter away the underlying CVD barrier bottom portion32 of FIG. 2 and may even slightly etch into the exposed face 38 of theunderlying metallic feature 14. With the finite tantalum ion flux, asidewall portion 74 of the first PVD barrier layer 70 is formed on thesides of the via hole 18, partially from the metal ions reflected offthe via bottom. The situation in the field area atop the dielectriclayer 16 is more complex. If the tantalum ion fraction is high and theion energy is sufficiently high, then the field portions of the firstPVD barrier layer 70 does not form and instead the field portion 36 ofthe CVD barrier is removed. However, in SIP and SIP⁺ sputtering, it ispossible to balance the ion and neutral fractions. The neutral fractiondoes not reach the protected bottom of the via hole but does reach thefield region with modest energy because they are not affected bypedestal biasing. Therefore, they can deposit on the field region morequickly than the energetic ions are removing material there. Therefore,it is possible to achieve a net deposit of the first PVD barrier layer70 over the field area. Gopalraja et al. have described in the abovecited patent application a similar sputter removal of a barrier layerduring sputter deposition of a copper seed layer.

Thereafter, in a second step of the PVD barrier deposition, a second PVDbarrier layer 80, illustrated in FIG. 8, is deposited in the same PVDchamber with the chamber conditions adjusted to produce a lower energyfor the sputtered metal ions. With the lower energies, the second PVDbarrier layer 80 forms with a bottom portion 82, a sidewall portion 84,and a field portion 86. The second step preferably at least begins withthe sputter deposition of tantalum or other barrier metal. The secondstep may include a subsequent deposition of titanium nitride byadmitting nitrogen into the plasma reactor to effect reactivesputtering.

Several methods are available to control the metal ion energy.Increasing the RF bias applied to the pedestal electrode through acoupling capacitor will increase the magnitude of the negative DCself-bias and thus increase the energy of the metal ions. At least inthe case of SIP and SIP⁺, either decreasing the chamber pressure orincreasing the target power will also increase the DC self-bias. Thus,the second PVD sputtering step should be performed at lower bias power,higher pressure, or lower target power than is the first PVD sputteringstep. Of course, adjustment of some combination of the three controlscan be used.

The previously described steps associated with deposition of the copperseed layer, electroplating of copper, and chemical mechanical polishingare similarly performed to produce the structure of FIG. 9, whichdiffers from that of FIG. 6 by the addition of the sidewall portion ofthe first PVD barrier layer 70.

The SIP and SIP⁺ sputter reactors allow tuning of not only the metal ionenergy but the ratio of ions to neutrals. This tunability allows thepossibility of very selective removal of the first barrier layer at onlythe bottom of the via in a dual-damascene structure, as illustrated inthe cross-sectional view of FIG. 10. A multi-step etching process isused to etch a dual-damascene hole in the upper dielectric layer 16including a via hole 90 for connecting to the underlying copper feature14 and a trench 92 providing horizontal interconnects. Usually, thereare multiple via holes 90 and corresponding underlying copper features14. The underlying copper feature 14 may be a copper-filled trench inthe lower metallization level. The trench 92 may have a lateral sizeonly slightly larger than the diameter of the via hole 90, but ittypically has a substantially longer length. Etch stop layers andunderlying barrier layers are not illustrated.

The CVD barrier layer 30 is conformally deposited over the horizontaland vertical surfaces of the via hole 90 and trench 92 as well as overthe field area on top of the upper dielectric layer 16. A first PVDsputtering step with energetic metal ions is used to remove the CVDbarrier layer 30 at the bottom of the via holes while depositing a firstPVD barrier layer 70 over the CVD barrier layer 30 on the via sidewall94, the trench floor 96, the trench sidewalls 98, and field area 100 ontop of the dielectric layer 16. The differential deposition,particularly on horizontal surfaces, can be achieved because the verynarrow access to the high-aspect ratio via hole 90 admits very fewneutral metal atoms to the bottom of the via hole 90, and instead theenergetic metal ions etch the CVD barrier layer 30 at the via bottom. Onthe other hand, the trench floor 96 is slightly more exposed in itslateral direction and significantly more exposed in it axial direction.As a result, a substantial number of the neutral metal atoms reach thetrench floor 96 and attempt to deposit there. On net, the depositedneutrals prevent the energetic metal ions from significantly etching theunderlying CVD barrier layer 30 on the trench floor 96. The field areasof the CVD barrier layer 30 are even more exposed to the neutral metalatoms, and a thicker first PVD barrier layer 70 grows there. A secondPVD sputter step preferably performed in the same PVD chamber coats asecond PVD barrier layer 80 over the entire exposed surface, includingthe bottom of the via hole 90.

Gopalraja et al. describe a similar sputter etch and sputter depositionprocess in U.S. application Ser. No. 09/703,601, now issued as U.S. Pat.No. 6,451,177, incorporated herein by reference in its entirety.

Thereafter, the copper seed layer (not illustrated here) is deposited,copper is electroplated into the via and trench and over the top of thetrench, and the structure is chemical-mechanically polished down to thedielectric layer 16 to produce the metallized dual-damascene structureof FIG. 11, in which a copper metallization 102 fills both the via 90and the trench 92. This structure is advantageous over that possiblewith the barrier removal of Geffken et al. in that the trench floor isprotected by a complete set of barrier layers preventing verticaldiffusion between the oxide layer 16 and copper metallization 102.

The steps described above are part of an integrated process for forminga liner in hole penetrating through a dielectric layer. The process flowis presented in the flow diagram of FIG. 12 and can be performed on asingle integrated tool such as that illustrated in FIG. 13. Beforeentering the system, the via hole is etched through the uppermostdielectric layer down to the underlying metallic feature. The etch mayform a dual-damascene structure and involve a more complex structure forthe dielectric layer. After the wafer enters the system, in step 110 thewafer is degassed. This operation is usually combined with anorientation step to orient the orientation indicia on the wafer in apredetermined direction. In step 112, the wafer is pre-cleaned by aprocess including subjecting the wafer to an argon plasma formed by aremote inductive coil with a chamber pressure of about 0.5 Torr withabout 300W of RF bias applied to the pedestal electrode. This softplasma etch removes spontaneous oxidation and other contaminants fromthe exposed surface.

In step 114, a CVD barrier layer is deposited, typically composed of TiNor TiSiN. As described before, the CVD barrier layer nearly conformallycoats the sidewalls and bottom of the via hole as well as the field areaon top of the dielectric layer.

Step 116 is a PVD operation that removes the CVD barrier layer at thebottom of the via. Depending upon the sputter chamber being used and theprecise process parameters, the first PVD barrier sputter step may coata first PVD barrier layer on the via sidewalls and possibly on the fieldarea. In a process tuned for dual damascene the first barrier PVD stepremoves the CVD barrier layer only at the bottom of the via hole butcoats the first PVD barrier layer on the trench floor and in the fieldarea. Step 118 sputter deposits another PVD barrier layer on all exposedsurfaces including the via bottom, via sidewalls, and field area as wellinto surfaces of the trench or trenches if any. For a coppermetallization, if the first barrier PVD step 116 net deposits thebarrier, it is preferably a metallic tantalum deposition. In eithercase, at least an initial part of the PVD barrier layer deposited in thesecond barrier PVD step 118 is preferably composed of tantalum.Optionally, a second part of the second PVD barrier layer is composed oftantalum nitride formed by admitting nitrogen into the PVD reactor. Thetwo barrier PVD steps 116, 118 are preferably performed in the sameplasma sputter reactor having a tantalum or other barrier metal target.

Finally, a copper seed layer is deposited in step 120, after which thewafer having a complete liner formed thereon is removed from the system.Subsequent steps of electro-chemical plating (ECP) and chemicalmechanical polishing (CMP) are performed elsewhere to complete theinter-level metallization. It is also appreciated that the inventiondoes not require ECP or CMP, but may instead use more conventionalsputter filling of the via and/or metal lithography of the horizontalinterconnects. It is further appreciated that the liner process is notrestricted to copper metallization, and the process may be adapted toaluminum metallization.

The integrated process of FIG. 12 may be practiced on an integratedtool, such as the Endura tool illustrated in schematic plan view in FIG.13 and available from Applied Materials, Inc. The system includes twocentral vacuum transfer chambers 124, 126 which are interconnectedthrough vacuum locked pass through stations 128, 130 and each of whichcontains a wafer robot 132, 134 capable of reaching any of multiplestations arranged around the periphery of the respective transferchambers 124, 126.

Wafers are loaded into and out of the first transfer chamber 124 throughwafer cassettes contained in load lock chambers 136, 138. Upon entry, anorient/degas chamber 142 rotates the wafer to the correct orientationand heats it sufficiently to degas it. A pre-clean chamber 144 thensubjects the wafer to an argon plasma pre-cleaning.

The wafer is then transferred to the second transfer chamber 126, whichis typically held at a higher vacuum than the first transfer chamber124. A CVD chamber 148 deposits the CVD barrier layer. A PVD chamber 150may be used for both PVD steps, both the first one operating to removematerial on the via bottom and a second one with a lower ion energy toproduce net deposition. If desired, the same chamber can be used forreactive sputtering of a nitrided barrier layer. For coppermetallization, the PVD chamber 150 typically has a tantalum target. Asecond PVD chamber 152 is used to deposit the copper seed layer.Thereafter, the wafer with its liner layer completely formed is returnedthrough the first transfer chamber 124 to a cassette in one of the loadlocks 136, 138. It is appreciated that for higher throughput the emptyspace on the second transfer chamber 126 can be used for a second CVDbarrier chamber 148 or a second PVD barrier chamber 150 depending ontheir relative processing rates.

A controller 154 is loaded with a process recipe through a removablerecording medium 156 and controls the operation of the entire integratedtool.

Although the invention has been described in context of the firstbarrier layer being deposited by a CVD method, the invention isapplicable to structures using first barrier layers deposited by othermethods. Atomic layer deposition (ALD) is a process for depositing thebarrier one atomic layer at a time. In another example, a firstsputtered barrier layer may comprise a first refractory metal, and asecond sputtered barrier layer may comprise a second refractory metalrequiring another sputter reactor.

It is appreciated that the various barrier layers may be based ondifferent materials than those discussed. The most common barriers arebased on the refractory metals titanium, tantalum, and tungsten andtheir nitrides, but other barriers are possible.

Accordingly, it is seen that the same sputtering chamber can be used fordistinctly different effects of removing restricted portions of a linerlayer as well as coating over the liner layer and other exposedportions.

1. A process for forming a copper interconnect in a substrate including a connect hole vertically extending through an inter-level dielectric layer, comprising the steps of: a first step, performed at least partially by atomic layer epitaxy deposition, of depositing a barrier layer comprising tantalum on sides of said hole; a second step of etching said barrier layer at a bottom of said hole selectively to said barrier layer on said sides of said hole: a subsequent third step, performed by physical vapor deposition, of depositing a copper seed layer over said barrier layer; and filling by electrochemical plating copper into said hole over said copper seed layer.
 2. The process of claim 1, wherein said barrier layer comprises tantalum nitride.
 3. (Cancelled)
 4. A process for forming a copper interconnect in a substrate including a connect hole vertically extending through an inter-level dielectric layer, comprising the steps of: a first step, performed at least partially by atomic layer epitaxy deposition, of depositing a barrier layer comprising tantalum on sides of said hole; a subsequent second step of etching said barrier layer at the bottom of the hole, wherein second step includes generating an argon plasma and biasing a pedestal electrode supporting said substrate to attract argon ions to said substrate, thereby etching said barrier layer; a subsequent third step, performed by physical vapor deposition, of depositing a copper seed layer over said barrier layer; and filling by electrochemical plating copper into said hole over said copper seed layer.
 5. The process of claim 4, wherein said generating step includes inductively coupling RF power into a plasma reactor containing said pedestal electrode.
 6. A process for forming a copper interconnect in a substrate including a connect hole vertically extending through an inter-level dielectric layer, comprising the steps of: a first step, performed at least partially by atomic layer deposition, of depositing a barrier layer comprising tantalum on sides of said hole, wherein said first step includes an initial CVD step for depositing a first part of said barrier layer and a subsequent sputtering step for depositing a second part of said barrier layer; a second step, performed by physical vapor deposition, of depositing a copper seed layer over said barrier layer; and filling by electrochemical plating copper into said hole over said copper seed layer.
 7. A process for forming a copper interconnect in a substrate including a connect hole vertically extending through an inter-level dielectric layer, comprising the sequentially performed steps of: a first step, performed by chemical vapor deposition, of depositing a first barrier layer comprising tantalum on sides of said hole; a second step, performed by sputtering, of depositing a second barrier layer comprising tantalum on said sides of said hole; a third step, performed by physical vapor deposition, of depositing a copper seed layer over said first and second barrier layers; and a fourth step, performed by electrochemical plating, of filling copper into said hole over said copper seed layer.
 8. The process of claim 7, wherein said chemical vapor deposition comprises atomic layer deposition.
 9. The process of claim 7, further comprising a fifth step performed after said first step performed in a sputter reactor of etching said first barrier layer at the bottom of said hole.
 10. The process of claim 9, wherein fifth step includes generating an argon plasma and biasing a pedestal electrode supporting said substrate to attract argon ions to said substrate, thereby etching said barrier layer.
 11. The process of claim 10, wherein said generating step includes inductively coupling RF power into a plasma reactor containing said pedestal electrode.
 12. The process of claim 7, wherein said chemical vapor deposition comprises atomic layer deposition.
 13. A process for forming a copper interconnect in a substrate including a connect hole vertically extending through an inter-level dielectric layer, comprising the steps of: depositing by a deposition process comprising chemical vapor deposition a nitrided barrier layer on sides of said hole; in a sputter reactor including a tantalum target, etching said nitrided barrier layer on a bottom of said hole; in said sputter reactor, depositing a material comprising tantalum on sidewalls of said hole to form a second barrier layer; depositing by physical vapor deposition a copper seed layer over said second barrier layer; and filling by electrochemical plating copper into said hole over said copper seed layer.
 14. The process of claim 13, wherein said deposition process comprises atomic layer deposition.
 15. The process of claim 13, wherein said nitrided barrier layer comprises TiSiN.
 16. The process of claim 13, wherein said second barrier layer comprises TaN. 17-41. (Not entered)
 42. A method of filling one or more of a via and a trench in a patterned substrate, comprising: a) depositing a generally conformal first barrier layer in one or more of the via and the trench on the patterned substrate by chemical vapor deposition, wherein the first barrier layer comprises a silicided nitride of a refractory metal selected from the group consisting of Ti, Ta, and W; b) removing the first barrier layer from horizontal surfaces of the patterned substrate; c) depositing a second barrier layer by physical vapor deposition; and d) then depositing one or more conductive materials.
 43. The method of claim 42, wherein depositing the conductive material comprises depositing a seed layer and a metal layer in the via and/or the trench after the second barrier layer is deposited.
 44. The method of claim 43, wherein the first barrier layer comprises a material is selected from the group consisting of Ti, Ta, W, and nitrides thereof.
 45. The method of claim 42, wherein the second barrier layer comprises at least one refractory metal selected from the group consisting of Ta and W.
 46. The method of claim 43, wherein the seed layer comprises copper.
 47. The method of claim 46, wherein the metal layer comprises is copper.
 48. The method of claim 42, wherein the first barrier layer is deposited and removed from horizontal surfaces of the patterned substrate within a single chamber of an integrated processing tool.
 49. The method of claim 48, wherein the chamber is a chemical vapor deposition chamber and the first barrier layer is deposited and etched in a sputter chamber.
 50. The method of claim 43, wherein the seed layer is deposited by physical vapor deposition.
 51. The method of claim 43, wherein the metal layer is deposited by chemical vapor deposition.
 52. The method of claim 43, wherein the metal layer is deposited by electroplating.
 53. The method of claim 42, wherein the second barrier layer comprises a material selected from the group consisting of Ta, TaN, W, WN, Ti, and TiN, and wherein the second barrier layer has a thickness of from about 2 nm to about 5 nm at the bottom of the via.
 54. A method of filling one or more holes in a patterned substrate, comprising: a) depositing a generally conformal first barrier layer on the patterned substrate by atomic layer deposition; b) removing the first barrier layer from horizontal surfaces of the patterned substrate; c) depositing a second barrier layer by physical vapor deposition; and d) then depositing one or more conductive materials to fill the holes.
 55. The method of claim 54, wherein depositing the conductive material comprises depositing a seed layer and a metal layer in the holes after the second barrier layer is deposited.
 56. The method of claim 55, wherein the first barrier layer comprises a material selected from the group consisting of Ta, TaN, W, and WN.
 57. The method of claim 56, wherein the second barrier layer comprises a material selected from the group consisting of Ta, TaN, T, TiN, W, and WN.
 58. The method of claim 57, wherein the seed layer comprises copper.
 59. The method of claim 58, wherein the metal layer comprises copper.
 60. The method of claim 55, wherein the seed layer is deposited by physical vapor deposition.
 61. The method of claim 55, wherein the metal layer is deposited by electroplating.
 62. The method of claim 54, wherein the second barrier layer comprises a material selected from the group consisting of Ta, TaN, W, WN, Ti, and TiN.
 63. A method of filling one or more of a via and a trench in a patterned substrate, comprising: a) depositing a generally conformal first barrier layer on the patterned substrate by chemical vapor deposition; b) removing the first barrier layer from the horizontal surfaces of the patterned substrate; c) depositing a second barrier layer by physical vapor deposition; and d) then depositing one or more conductive materials.
 64. The method of claim 63, wherein depositing the conductive material comprises depositing a seed layer and a metal layer in the via and/or the trench after the second barrier layer is deposited.
 65. A method of filling one or more of a via and a trench in a patterned substrate having a metal layer underlying the via, comprising: a) depositing a generally conformal first barrier layer on the patterned substrate by chemical vapor deposition, wherein the first barrier layer comprises a silicided nitride of a refractory metal selected from the group consisting of Ti, Ta, and W; b) removing the first barrier layer from horizontal surfaces of the patterned substrate; c) depositing by physical vapor deposition a second barrier layer sufficient to provide a barrier on the bottom of the trench; and d) then depositing one or more conductive materials.
 66. A method of filling one or more of a via and a trench in a patterned substrate having a metal layer underlying the via, comprising: a) depositing a generally conformal first barrier layer on the patterned substrate by atomic layer deposition; b) removing the first barrier layer from horizontal surfaces of the patterned substrate; c) depositing by physical vapor deposition a second barrier layer sufficient to provide a barrier on a bottom of the trench; and d) then depositing one or more conductive materials.
 67. The process of claim 3, wherein said etching is performed with energetic ions. 